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2OZ Copper Double Layer Circuit Board Power Supply Product PCB

Witgain Technology Limited
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    Buy cheap 2OZ Copper Double Layer Circuit Board Power Supply Product PCB from wholesalers
     
    Buy cheap 2OZ Copper Double Layer Circuit Board Power Supply Product PCB from wholesalers
    • Buy cheap 2OZ Copper Double Layer Circuit Board Power Supply Product PCB from wholesalers
    • Buy cheap 2OZ Copper Double Layer Circuit Board Power Supply Product PCB from wholesalers

    2OZ Copper Double Layer Circuit Board Power Supply Product PCB

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : PCB000303
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 10 days
    • Product Details
    • Company Profile

    2OZ Copper Double Layer Circuit Board Power Supply Product PCB

    2 OZ Copper Power Supply Product PCB Double Layer Circuit Board


    • Main Features:

    1 2 Layer FR4 substrate material printed circuit board.

    2 Double layer copper, copper thickness is 70um/70um.

    3 Finished pcb thickness is 1.6mm.

    4 Used in power supply product..

    5 ENIG+Carbon ink surface treatment.

    6 2 layer pcb with 7/7mil min line space and width.

    7 Green solder mask and white silkscreen.

    8 Need customer to send us the gerber file or PCB file


    • Our Equipment List:

    NOEquipment NameEquipment BrandEquipment QTY
    1Automatic CuttingSCHCLLING-CA68581
    2Roll CuttingQIXIAN2
    3Vertical CuttingSHANGYUE2
    4Innerlayer pretreatmentJIECHI4
    5Automatic coat&wiringQUNYU4
    6Automatic exposureCHUANBAO11
    7Large table exposureHECHUAN2
    8Laser PlotterORBOTEC3
    9Etching lineKB4
    10PE PunchingPE-30001
    11AOIORBOTEC10
    12Double row brownKB3
    13PP CuttingZHENGYE5
    14PP ChoppingZHONGDA2
    15Hot-melt machineHANSONG6
    16Riveting machineJIAOSHI6
    17X-Ray CheckHAOSHUO5
    18Automatic refluxLANDE2
    19Steel plate washerFENGKAI2
    20Large size pressDATIAN8热4冷
    21X-Ray Drilling targetHAOSHUO8
    22Ccd Drilling targetXUELONG10
    23Automatic grindingXINHAO5
    24Plate thickness MeasuringAISIDA2
    25Four axis gongs machineDALIANG2
    26Two axis gongs machineBIAOTEFU4
    27Automatic grinding millJIEHUI2
    28Drilling machineTONGTAI13
    29Hole testing machineYAYA1
    30Sinking rough millKB1
    31Vertical copper wireYAMEI1
    32Automatic electroplating lineJINMING1
    33Dryer after electroplatingKB1
    34Etch machineKB1
    35Film checking machineYUBOLIN2
    36Line pre-processingKB2
    37Automatic laminatorZHISHENG3
    38Outer exposure machineCHUANBAO8
    39Outer exposure machineHECHUAN3
    40Etch machineJULONG1
    41Line developing machineKB1
    42Sand blasting machineKB1
    43Precoarsening pretreatmentKB2
    44Electrostatic spraying lineFURNACE1
    45Automatic screen printing machineHENGDAYOUCHUANG12
    46Pre baked tunnel furnaceKB1
    47Solder resist exposure machineCHUANBAO6
    48Solder resist exposure machineHECHUAN2
    49Post baked tunnel furnaceGC0-77BD2
    50Solder resist developing machineKB1
    51Screen printing machine1.8mm/2.0mm4
    52Character baking tunnel furnaceGC0-77BD1
    53Sunk Tin spray line2
    54Nickel palladium and gold wireXINHUAMEI1
    55Alternator2
    56OSP lineKB1
    57Gongs machineYIHUI20
    58V-CUTZHENGZHI1
    59CNC V-CUT machineCHENGZHONG2
    60Hydraulic punch pressSRT2
    61Test machineMASON17
    62High speed flying needle testerWEIZHENGTAI3
    63Four wire flying needle testerXIELI2
    64Product washing machineKB2
    65Plate warping machineXINLONGHUI2
    66Vacuum packaging machineSHENGYOU4

    • FQA:

    Q1: What is Backdrilling in PCB Fabrication?

    A1:


    2OZ Copper Double Layer Circuit Board Power Supply Product PCB


    Back drilling or Controlled depth drilling is a process used to remove the unwanted portion of a PCB Via Stub. Plated Through Hole (PTH) Vias are used to connect two or more layers of a Printed Circuit Board to each other. However often, a via does not need to run the entire thickness of the board to connect each layer. For example, if we have a 10 layer PCB and need to connect layer 1 to layer 3 using a via, the PTH via runs through all the layers of the PCB even though layers 3 to 10 do not need to be connected to each other using that particular via. This unused portion of the via is called a stub. These stubs can cause significant signal distortion (click here to read more about PCB via Stubs).

    Backdrilling is a technique used to remove the unused portion of the stub (conductive plating) in a printed circuit board. This is removed by using a drill that has the diameter slightly larger than the diameter of the original via (PTH) hole. In practice, it is achieved by re-drilling the PTH down to a predetermined stub length of less than 10 mils from the signal layer.


    2OZ Copper Double Layer Circuit Board Power Supply Product PCB


    In case the via is connecting two internal layers only, then it is necessary to remove the top and bottom stub to improve the high-speed signal quality (see figure below). Backdrilling is a cost-effective solution as compared to the lamination technique (used for blind and buried vias) to manage the signal quality in a high-speed signal bath. If properly executed, it will not affect the performance and reliability of the PCB.


    2OZ Copper Double Layer Circuit Board Power Supply Product PCB


    How does the stub length distort the signal quality?


    When a signal flows down the length of a via, it splits into two parts at the junction between the internal layer and stub. One part travels towards the receiver end through the internal layer, and the other part travels towards the stub end. The stub act as an unterminated transmission line, so the signal reflects back towards the junction. At the junction, the signal again split into two with one signal returning to the source, and the other following the trace. Hence, the source signal is disturbed. The source distortion is the main cause for deterministic jitter (deviation clock pulse edge from its original position). Then the deterministic jitter leads to an increase in Bit error rates (BER), cross talk, EMI/EMC radiation, and the attenuation.


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